Design of an IoT System for Chip Component Taping Workshop Based on OPC UA Architecture

To address the demand for digital transformation and intelligent upgrading in the taping workshops of China's electronic component manufacturing sector, proposes and designs an internet of things (IoT) system based on the OPC UA (open platform communications unified architecture) protocol. Firstly, provide an overview of the overall technical solution of the system. Secondly, analyze the hardware and software design of the system and its specific implementation methods. Finally, analyze the specific results of the system application. The system has been successfully deployed in the taping workshop of a leading domestic multi-layer ceramic capacitor (MLCC) manufacturer, effectively resolving common technical challenges in discrete manufacturing, such as high barriers to equipment interconnection, rigid process parameter control, and delayed quality traceability responses. This implementation provides a replicable practical paradigm for the digital and intelligent transformation of the discrete manufacturing industry.