Abstract: Digital image correlation (DIC) technology has been widely used in full-field deformation measurement of materials and structures, but it still faces some problems in high-temperature environment. Based on this, firstly, the development trend of high-temperature deformation measurement technology and the research status of high-temperature DIC technology are summarized. Subsequently, the principle and system of high-temperature DIC measurement are analyzed, corresponding solutions are proposed for the key problems such as speckle oxidation detachment, thermal radiation interference and thermal flow disturbance in high-temperature environment, and the application progress of high-temperature DIC technology is described. Finally, the future development direction of high-temperature DIC technology is prospected.